Backed by a team of experienced personnel, we are manufacturing and supplying Double Sided Planetory Lapping Machine. It is an ideal lapping tool for performing the lapping process on silicon wafers and germanium wafers. The offered machine is highly appreciated for performing surface finishing operations with precision. Thus, it carried out the process that is reserved for products that demand tight tolerances of flatness, parallelism, and thickness. Moreover, in a Double Sided Planetory Lapping Machine components are placed within the confines of conditioning rings directly onto a surface of rotating lap plate.